3500/40-03-00From quality to capacity, what is the key?

The production quality and productivity efficiency of diamond wire electroplating equipment are the focus of current equipment manufacturers. To this end, building an advanced distributed automatic control system based on reliable and fast electrical connection technology to improve production line performance is one of the keys to addressing these challenges.

On the one hand, because the electroplating quality of the diamond wire determines its cutting performance, which directly affects the quality and cell efficiency of photovoltaic silicon wafers, it is necessary to ensure efficient sand control through stable and efficient electrical connection technology, including key pa3500/40-03-00rameters such as tension, current, sand amount, and automatic processes such as electroplating quality detection

On the other hand, with the number of equipment inlet lines from two inlet lines, four inlet lines to today’s twelve inlet lines, to meet the continuous plating equipment is getting longer and longer, and its production line speed per minute is also getting higher and higher, which undoubtedly means that the production capacity of diamond wire equipment is also doubling to meet the production capacity needs of downstream silicon cutting. Based on high-performance electrical connectivity solutions, the distributed control system of the entire equipment can be quickly deployed and commissioned, enabling the design, manufacture and rapid delivery of higher capacity equipment.

Therefore, in order to improve the quality and productivity efficiency of diam3500/40-03-00ond wire electroplating equipment, the HDC heavy-duty connector and 5-core high-current photovoltaic connector provided by Weidmuller provide reliable power and signal transmission of the electrical control part in the entire key automation system of electroplating equipment.