IC693DSM302-AE Digital image correlation (DIC) technology analyzes the deformation of objects by comparing the pixel displacement between two or more images, and obtains the 3D displacement field, 3D strain field and 3D deformation field data through 3D reconstruction and digital image correlation algorithm.
DIC test technology is to capture the feature points on the sample surface and calculate the position of the feature points to calculate the deformation information of the sample surface. DIC testing technology can be used to study and analyze the evolution of full-field strain of the sample during the loading process, analyze the strain distribution in different regions of the sample during the loading process, and analyze the influence of the arrangement of strong and weak structures on the deformation and failure of the sample.
XTDIC three-dimensional full-field strain measurement system, based on digital image correlation technology (DIC) and marker tracking measurement technology, provides reliable and accurate measurement data for product development and testing, which can be used for mechanical property testing of materials, fatigue, strength, vibration analysis and other mechanical behavior characterization.
1, optical device DIC full-field deformation test
In the production process of optical devices, in addition to the repeated simulation and processinIC693DSM302-AE g of optical components to reduce imaging or optical path errors, the assembly process is also a key link that directly affects the performance and accuracy of the system.
In the process of mechanical installation of optical devices, the error caused by vibration and deformation of optical devices will directly affect the precision index and performance of products, so it is very important to measure the displacement and vibration of optical devices in the process of assembly. XTDIC three-dimensional full-field strain measurement system has prominent advantages in full-field non-contact displacement vibration detection, which can monitor the position and process of error in the actual production and installation process, so that the accuracy index can be optimized during the installation process.
DIC test process
The digital image correlation method (DIC) tracks the deformation process of the speckle pattern on the surface of the object and calculates the change of the gray value of the speckle region, so as to obtain the deformation and strain data of the surface of the object.
As an optical device processing product, it is not practical to spray speckle paint on the surface of the measurIC693DSM302-AE ed object, and Xinto 3D technical engineers use the way of sticking to dynamically monitor the position where displacement or vibration may occur.
The analysis of gear dynamic meshing deformation is an effective way to understand gear vibration, but there are many problems in the calculation of gear dynamic deformation by traditional analysis methods:
1, theoretical research and simulation verification, lack of real loading data verification
2, the gear surface can not be measured in the whole field, it is difficult to record the deformation of the key position of the sample
3. Lack of effective testing methods for dynamic meshing force and deformation of gears.
DIC three-dimensional deformation measurement scheme
Digital image correlation technology (DIC) measures 3D full-field surface displacement, deformation, strain, and vibration frequencies without contact with the specimen.
Xintuo 3D XTDIC 3D optical strain measurement system tests the deformation and strain of gear meshing parts under load during gear meshing rotation. After braking force is applied, the deformation and vibration frequencies of the gear are measured
