IC693MDL330 The way of selection is scientific and rigorous
IC693MDL330 In the project selection, the institute conducted a full investigation and evaluation of the “digital process design system”, combined with the complex application scenarios frequently used in business, and proposed key evaluation indicators for each manufacturer’s system in terms of performance, automation technology, intelligence degree, production flexibility, sustainable iteration, etc. It also requires each…
Read articleIC693MDL7346 Introduction of EtherCAT Bus Line servo
IC693MDL7346 Servo system determines the precision, control speed and stability of automation machinery, and is the core of industrial automation motion control. In recent years, with the rapid development of new energy, semiconductor equipment, electronic and electrical equipment and other industries, the application scenario of servo system is becoming more and more complex: compared with…
Read articleIC693MDL390 Strategic deployment of smart electronics, strive to be the industry leader
IC693MDL390 Recently, Kaimu Software successfully signed a major project of “digital process design system” of a research institute of China Electronics Technology Group! The project will be based on KMPLM CLOUD, which is independently developed by Kaimu and integrates cloud native, microservice and design process manufacturing, to build a digital process design and management platform…
Read article489-P5-LO-A20-T Localization is the right time
489-P5-LO-A20-TThe MYD-YD9360 development board adopts the structure of core board and bottom plate. The core board is based on the chip of Xinchi D series. The whole core module is covered with heat sink (the heat sink has been removed in the figure). The bottom plate is mainly an extension of the functional interface, which…
Read article489-P5-HI-A20-T-H Expand 3D packaging capabilities
489-P5-HI-A20-T-H Brad Seo, Vice President of SAPEON Korea Research and Development Center, said: “nepes is committed to providing customers with comprehensive semiconductor package design and manufacturing service solutions to help customers achieve sustained success in the semiconductor market. “In today’s semiconductor industry, where performance and small size are increasingly demanded, the collaboration between nepes and…
Read articleSPAJ141C Reduce costs and increase efficiency
SPAJ141C With its easy programming, fast deployment, high security and other characteristics, FAO-AO collaborative robots help CNC automation upgrade and speed up, so that manufacturing enterprises can achieve flexibility in production capacity and quickly adapt to diversified product production needs in the production process. 01 High labor cost In recent years, the problem of factory…
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