Product introduction：

5SHX2645L0002 3BHB012961R0001 3BHE009681R0101 GVC750BE01 Power semiconductor modules are commonly used in the

field of power electronics, they are able to handle and control high voltages and currents, and are widely used in a variety of power systems

and industrial applications. Such as motor drives, power conversion, solar inverters, wind energy systems, electric vehicle chargers, etc.
​5SHX2645L0002 3BHB012961R0001 3BHE009681R0101 GVC750BE01 These modules may have the following features:
High efficiency: Use of advanced semiconductor materials and technologies to reduce power losses.
High reliability: Designed to withstand harsh working environments and long-term stable operation.
Compact design: Space saving and easy integration into various power equipment.
Multiple packaging options: adapted to different application requirements and installation conditions.
Protection function: May include overcurrent, overvoltage, overheating and other protection mechanisms.

5SHX2645L0002

​The high efficiency of power semiconductor modules is mainly achieved through the following advanced technologies:
Wide band gap semiconductor materials: such as the use of silicon carbide (SiC), which has about 3 times the band gap width of silicon,

10 times the critical breakdown field strength, and about 3 times the thermal conductivity, these characteristics allow silicon carbide devices

to operate under more stringent conditions, with higher efficiency and power density, while reducing the cost, volume and weight of the system.
Integrated gate commutated thyristor (IGCT) technology: IGCT technology combines the high current tolerance of thyristors with the fast switching

characteristics of IGBTs to provide high buffer off ratings and optimization for medium frequency and wide temperature ranges for applications requiring high reliability and high electromagnetic immunity.

5SHX2645L0002

Advanced packaging technology: including more advanced connection materials and processes, such as silver sintering technology, which has high thermal conductivity,

low sintering temperature and high melting point, suitable for high temperature working conditions, compared to traditional tin welding technology,

silver sintering can achieve zero holes and better electric heating performance.
​Low stray inductance package design: The new package structure design reduces the stray inductance parameters, ADAPTS to the high frequency

characteristics of the device, improves the switching speed and reduces the loss.
Multifunctional integrated package: Integrates multiple functions, such as temperature sensors and advanced thermal design, for better system thermal

management and improved module heat dissipation and power density.
Chip thinning process: With the development of chip thinning process, higher requirements are put on packaging to achieve higher power density and better thermal management.
High reliability design: includes material matching, efficient heat dissipation, low parasitic parameters and high integration, as well as package process

controls such as low cavity rate welding/sintering, high reliability interconnect, ESD protection and aging screening

About Chengdu Sunshine Xihe Electric Co., Ltd

Chengdu Sunshine Xi He Electric Co., Ltd. specializes in selling the world’s major electrical brand products overseas direct procurement,

genuine inventory, price preferential after-sales warranty, complete models, the same product, not the same price and service.

Large supply of original imported DCS system accessories, PLC system accessories.

Main :ABB, GE Fanuco, Bentl Bentley, Triconex Invensys, Woodward Woodward, Foxboro, Foxboro,

Westinghouse /Emerson, Reliance Ryan, SchneiderModicon, A-B, HIMA dark horse, Motorola MOTOROLA,

Kollmorgen Kollmorgen Bosch/Rexroth/ Bosch Rixon, NI,YOKOGAWA Yokogawa, and other major brands of DCS system accessories,

robot system accessories, large servo system discontinued spare parts.

Contact us freely

BeiLin

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Email contact：18005021035@163.com

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