UR9GH This technology was first applied to Intel processors, because this packaging technology compared to the previous “metal contact package” has many advantages, so it quickly became popular.

With the continuous change of market demand, the use of LGA packaging technology on a single chip can no longer meet the demand, so a variety of chips and devices are packaged together through LGA modules. For example, the core board of Mill Electronics LGA package shared with you before.

At present, Mill Electronics has made the core board of LGA packaUR9GH ge based on a number of MCU/MPU:

There are many manufacturers on the market that do similar LGA packaging core boards, but the core board of Mill Electronics LGA packaging is still very characteristic, and it can be said that it has achieved “innovative design” :

LCC/LGA package design: more stable and reliable signal connection, better vibration resistance, easy to mass produce batch patches.
Shield design: anti-signal interference and anti-dust, while supporting customized LOGO, enhance customer brand value.
Compact design: Small size, flexible design, suitable for all sizes of produUR9GH cts (especially structurally limited products.